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学术论文
  1. Tao Zhang, Qijun Lu*, Zhangming Zhu, Jincan Hu, Haiyang Xia, Lianming Li, and Tiejun Cui, “Milimeter-Wave Antenna-in-Package Applications Based on D263T Glass Substrate,” IEEE Access, 8: 67921−67928, Apr. 2020.
  2. Qijun Lu, Zhangming Zhu*, Guangbao Shan, Yang Liu, Xiaoxian Liu, and Xiangkun Yin, “3-D Compact 3-dB Branch-Line Directional Couplers Based on Through-Silicon Via Technology for Milimeter-Wave Applications,” IEEE Transactions on Components, Packaging and Manufacturing Technology, 9(9): 1855−1862, Sep. 2019.
  3. Guangbao Shan, Qijun Lu*, Song Liu, and Yintang Yang, “Through-Silicon Capacitor Interconnection for High Frequency 3-D Microsystem,” IEEE Transactions on Components, Packaging and Manufacturing Technology, 9(7): 1310−1318, Jul. 2019.
  4. Qijun Lu, Zhangming Zhu*, Yang Liu, Xiaoxian Liu, and Xiangkun Yin, “Wideband Electromagnetic Modeling of Coaxial-  Annular Through-Silicon Vias,” IEEE Transactions on Electromagnetic Compatibility, 60(6): 1915−1922, Dec. 2018.
  5. Jianqin Deng, Qijun Lu*, Yingtang Yang, and Zhangming Zhu, “A 110-170 GHz Spatial Power-Combined Frequency Tripler with 5.7%-7.8% Efficiency and 0.5 W Power Handling,” Microwave and Optical Technology Letters, 60(5): 1079−1085, May 2018.
  6. Qijun Lu*, Zhangming Zhu, Yintang Yang, Ruixue Ding, and Yuejin Li, “Closed-Form Internal Impedance Model and Characterization of Mixed Carbon Nanotube Bundles for Three-Dimensional Integrated Circuits,” Chinese Physics B, 27(1): 017303, Jan. 2018.
  7. Qijun Lu, Zhangming Zhu*, Yintang Yang, Ruixue Ding, and Yuejin Li, “High-Frequency Electrical Model of Through-Silicon Vias for 3-D Integrated Circuits Considering Eddy Current and Proximity Effects,” IEEE Transactions on Components, Packaging and Manufacturing Technology, 7(12): 2036−2044, Dec. 2017.
  8. Qijun Lu, Zhangming Zhu*, Yintang Yang, Ruixue Ding, and Yuejin Li, “Electrical Modeling and Analysis of Cu-CNT Heterogeneous Coaxial Through-Silicon Vias,” IEEE Transactions on Nanotechnology, 16(4): 695−702, Jul. 2017.
  9. Qijun Lu, Zhangming Zhu*, Yintang Yang, and Ruixue Ding, “Analysis of Propagation Delay and Repeater Insertion in Single-Walled Carbon Nanotube Bundle Interconnects,” Microelectronics Journal, 54: 85−92, Jul. 2016.
  10. Qijun Lu, Zhangming Zhu*, Yintang Yang, and Ruixue Ding, “Electrical Modeling and Characterization of Shield Differential Through-Silicon Vias,” IEEE Transactions on Electron Devices, 62(5): 1544−1552, May 2015.
  11. Qijun Lu, Zhangming Zhu*, Yintang Yang, and Ruixue Ding, “Influence of Temperature on the Conductivity of Multi-Walled Carbon Nanotube Interconnects,” Chinese Physics Letters, 32(4): 047305, Apr. 2015.
  12. Qijun Lu, Zhangming Zhu*, Yintang Yang, and Ruixue Ding, “Accurate Formulas for the Capacitance of Tapered-Through Silicon Vias in 3-D ICs,” IEEE Microwave and Wireless Components Letters, 24(5): 294−296, May 2014.
  13. Qijun Lu, Zhangming Zhu*, Yintang Yang, and Ruixue Ding, “Type of Distortionless Through Silicon Via Design Based on the Multiwalled Carbon Nanotube,” IET Micro & Nano Letters, 8(12): 869−871, Dec. 2013.